APPLICATIONS

Wafer Geometry Inspector

Results of Profile Measurements

	Geometrical parameters of a wafer edge

The evaluated results include the following geometrical quan-tities which can also be determined for the edge in the notch area:

 

• Facet lengths A1, A2
• Blunt lengths B, Bw, B1, B2
• Angles Ang1, Ang2
• Radii R1, R2
• Wafer thickness T

Profile deformations

Profile deformations are best identified by means of a detailed geometrical comparison of the measured profile (scatter plot) and the calculated contour. The maximum deviation is of decisive importance in this connection.

Results of Top-view Measurements

The results parameters of top-view measurements are used for a full geometrical characterisation of the notch.

Specific Evaluations

Optional evaluation modules can be provided for the calculation of specific values, including feedback values for production equipment and the geometric parameters of grinding grooves.