APPLICATIONS

Wafer Geometry Inspector

System Overview

Setup

• All components are installed in a closed rack
• Vibration absorption provided by a solid slab of granite with centrally adjustable pneumatic damping elements
• Precision rotary stage with PEEK wafer chuck and vacuum fixation or PEEK edge grip system
• Precision linear stages for sensor positioning
• Intelligent light-sectioning sensors with extremely short line lengths and laser protection class 2 (DIN EN 60825-1)
• Optional telecentric profile projection unit
• Precision camera system for top-view measurements
• Robust, high-performance, industrial PC
• Full-format flow unit with U16 filter and adjustable air flow
• Weight approx. 250 kg

Standards

• All procedures and evaluations comply with SEMI guidelines
• SECS II/GEM data interfaces
• SEMI, CE and ROHS compliance
• Conforms to the EC Machinery Directive

Accuracies

The following accuracies have been determined for the parameters calculated by the measuring system

	Accuracy	Deviation
Radii	±1 µm	1 µm
Half angles	±0.2°	0.05°
Blunt lenghts	±2 µm	1 µm
Facet lengths	±2 µm	1 µm
Profile deformation	>5 µm	-